The company was founded in 2011 and is a design company that provides RF front-end chips for smart phones, the Internet of Things, etc. Since its establishment, the company has focused on reconfigurable RF front-end architectures, adopted a hybrid RF front-end technology route based on the “insulated silicon (SOI) + gallium arsenide (GaAs)” material system, and achieved technological breakthroughs and large-scale commercialization, so that RF front-end devices can be multiplexed in different frequency bands, modes, formats and scenarios through software configuration, achieving optimization in various aspects of performance, cost, and size, helping global customers simplify and keep pace with the times. The main business is R&D, design and sales of RF front-end chips and modules. The company's main products are L-pamif transmission modules, L-FEM receiving modules, L-pamid high integration modules, 5G MMMB PA discrete modules, receiving modules, 4G multi-frequency multi-mode power amplifier modules, Wi-Fi FEM products, etc. Corporate honors: It won the first prize of the China Communications Society Science and Technology Award, the 4G reconfigurable RF front-end chip kit S5643-51 product independently developed by the company won the 14th “China Chip” Outstanding Market Performance Product Award, and the SOI Product Alliance's “SOI Industry Achievement Award”.